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KOOCU 0.3mm 63/37 Rosin Core Soldering Wire bonds electronic components at a 183°C eutectic melting point. This 0.3mm diameter wire targets precision on high-density PCBs and mobile motherboards. With its 63/37 lead-tin ratio, the alloy transitions instantly from solid to liquid for stable joints.
Key Features
- Eutectic 63/37 Alloy: Sn63/Pb37 ratio melts at a fixed 183°C point. Prevents cold joints on circuits.
- Ultra-fine 0.3mm Diameter: Narrow wire profile feeds onto microscopic SMT pads. Reduces solder bridges in layouts.
- Integrated Rosin Core: Flux content between 1.2% and 2.0% cleans oxidation. Removes oxides during the heating.
- Thermal Stability: 240-330°C working range handles varying iron temperatures. Maintains flow during BD load shedding.
Frequently Asked Questions
What is the melting point of 63/37 solder?
The 63/37 alloy melts at exactly 183°C. This temperature provides a quick transition from liquid to solid.
Is 0.3mm solder good for SMD?
The 0.3mm thickness targets microscopic surface-mount device pads. It prevents excess solder buildup on dense boards.
