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Mechanic XG50 BGA Soldering Paste utilizes a Sn63/Pb37 eutectic alloy for reballing and SMT repair. The 183°C melting point enables reflow without excessive thermal stress on sensitive mobile motherboards. This version improves viscosity stability with enhanced IPX3 flux compared to the previous XG-40 model.
Key Features
- Sn63/Pb37 Alloy: Eutectic composition with 63% tin and 37% lead. Provides stable joints and consistent wetting.
- IPX3 No-Clean Flux: Reduced residue levels after soldering without post-work cleanup. Minimizes board contamination under heavy sweat or humidity.
- Type 3 Particles: Microscopic spheres sized between 25-45um for precision work. Fits through fine-pitch stencils without clogging.
- Temperature Sensitive: Storage required between 0-10°C to maintain 6-month shelf life. Prevents paste drying or flux separation.
- High Viscosity: Thick 160-230Pa.s consistency for stable component placement. Holds SMD parts in place during reflow.
Frequently Asked Questions
How to store Mechanic XG50 solder paste?
Keep the container between 0-10°C inside a refrigerator. This temperature range preserves the 160-230Pa.s viscosity and prevents chemical separation.
Is Mechanic XG50 lead free?
No, this paste contains 37% lead alongside 63% tin. The lead content lowers the melting point to 183°C for easier reflow.
