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BAKU BK-80 Soldering Paste stabilizes electrical connections through a neutral pH 7 rosin base. The 183°C melting point facilitates rapid flow for PCB and SMD repairs. Medium-thick viscosity prevents the flux from running off vertical joints during application.
Key Features
- Neutral pH 7 Formula: Rosin base prevents acid-induced circuit corrosion over time. Protects delicate PCB traces from long-term decay.
- High-Intensity Joint Strength: Molecular bonding creates durable electrical connections under thermal stress. Prevents solder joints from cracking during use.
- 183°C Melting Point: Medium-thick paste liquefies quickly for rapid SMD and wire attachment. Reduces time spent under the soldering iron tip.
- Low Smoke Emission: Reduced chemical fumes maintain visibility during intricate BGA reballing tasks. Improves clarity in humid BD repair shops.
Frequently Asked Questions
Is BAKU BK-80 flux non-corrosive?
The neutral pH 7 formula leaves no acidic residue on components. This prevents the oxidation of copper traces and sensitive electronics pins.
How to use BAKU soldering paste?
Apply a small amount to the PCB pad or wire before heating. The 183°C melting point triggers the flow to clean and bond the metal surfaces.
